৳600 বা তার বেশি অর্ডারে কুরিয়ার ডেলিভারি চার্জ মাত্র ৳85।অর্ডার কনফার্ম হওয়ার পরের দিন কুরিয়ারে শিপ করা হবে।কুরিয়ারে ডেলিভারি হতে সাধারণত 2–4 দিন এবং পোস্ট অফিসে 2–12 দিন সময় লাগতে পারে।
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Protype your circuits efficiently with the Half-Size 400 Tie-Point Solderless Breadboard from iotnestbd. Perfect for compact Arduino projects, ESP32 modules, sensor testing, and microcontroller circuits, this half-size breadboard provides an ideal workspace when you don't need a full-sized board.
Featuring clearly marked alphanumeric coordinate grids, interlocking sides for modular expansion, and integrated power distribution rails, this breadboard guarantees secure component connections and a tidy layout.
400 Tie-Point Capacity: Offers a balanced workspace (300 terminal strip tie points + 100 power rail tie points) for sensors, ICs, and microcontrollers.
Dual Power Distribution Rails: Includes side power strips with clear positive (+) and negative (-) polarity markings for clean voltage routing.
Standard 0.1" (2.54mm) Grid: Fully compatible with standard DIP ICs, header pins, jumper wires, and breakout modules.
Durable & Reusable: High-grade white ABS plastic body with nickel-plated spring clips rated for thousands of secure insertion cycles.
Self-Adhesive Backing: Comes with peel-and-stick adhesive tape on the bottom to securely mount your breadboard to project cases or test benches.
Product Type: Half-Size Solderless Breadboard
Total Tie Points: 400 points (300 terminal + 100 distribution)
Material: White ABS plastic housing with nickel-plated spring contact clips
Dimensions: Compact size (approx. 8.2cm x 5.5cm)
Backing: Peel-off self-adhesive tape